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35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

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35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL

Brand Name : JIMA

Model Number : EDCU-HC

Certification : SGS, ISO,Reach, RoHS

Place of Origin : China

MOQ : 100kg

Price : Negotiation

Payment Terms : T/T, L/C

Supply Ability : 1000 Ton per month

Delivery Time : 5-15 days

Packaging Details : wooden carton

Purity : 99.95%

Name : 35um HTE Electrolytic Copper Foil 1oz For Rigid PCB and CCL

Thickness : 1/2 oz,3/4 oz,1 oz,2 oz,

Color : red or black

Elongation : ≥ 1.5%

Tensile strength : ≥ 160 MPa

Peel strength : ≥ 1 N/mm

Foil profile : RA≤0.15μm，Rz≤1.7μm

Length Per Roll : 500 - 5000 Meter

Inter Diameter : 76 Mm，152 Mm， 3 Inch，6 Inch

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35um HTE Electrolytic Copper Foil 1oz For Rigid PCB and CCL

Detail Specification:

Single side treatment in red.
Nominal Thickness: 0.012-0.070 mm,35um,70um
Width range: 100-1380mm,standard width:1290mm
Length range : 500-5000 M
Internal diameter: 3 inch,6 inch.
Sample: can be supply


Classify:

(STD-E)- standard electrodeposited copper foil.
(HD-E)-high ductility electrodeposited copper foil.
(HTE-E)-high temperature elongation electrodeposited copper foil.

35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL
HTE Copper Foil Application

PCB industry .
Application PCB manufacture
antenna PCB,Epoxy board
Epoxy board
Rigid PCB
CCL

FAQ:

Q1: Can you customize the special size as per our requirement?
A:we can cut into as your request size.

Q16. How to save after the box opened?
A: Keep the dry environment,and is better use it in 30days.

Q4: Can you supply the sample?
A: We can supply A4 samples


HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1
Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2
Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9
(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

Copper≧

 % 99.8

IPC 4562

4.6.3.1
Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4
state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3
state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

 No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.
We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp
Packing photos :
35um 1oz Electrolytic HTE Copper Foil For Rigid PCB / CCL


Product Tags:

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